Despite the great secrecy surrounding the performance and features of the new high-end processor, a first technical sheet unfolds.
While Qualcomm is in turmoil for abuse of dominant position in the market of mobile processors, the American manufacturer must also face a leak of the data sheet of its latest high-end chip.
A chip engraved in 10nm FinFET
It is VideoCardz that unveils the pot of roses: Snapdragon 835, a new high-end Qualcomm chip, displays its features through a slide show scheduled for a press conference (January 3) or the keynote of January 6, presented by Its CEO Steven Mollenkopf - or even, in a more distant future, upstream of the CES 2017 which will start on January 5.
The card is all the more interesting because it allows to know the performance of the chip that can be found on most high-end smartphones this year and beyond. Engraved in 10nm FinFET, the processor is intended especially and especially smaller than the previous ones, while offering characteristics more advanced than the previous generation, with a performance improvement of up to 20% in the task management, RV and Web browsing.
We keep the big.LITTLE architecture that manages multitasking by devoting 4 of its hearts to gourmet resources and 4 hearts with more common tasks (SMS, calendar, notepad, etc.). Engraving FinFET also allows a lower consumption of energy and (a little) less space occupied.
A rich year for Qualcomm
In 2017, Qualcomm will also unveil its 5G chip, in test at least, before a consumer release in 2018. With transfer speeds estimated at 5 Gbps, mobile data will be repatriated faster than ever on your smartphone. To learn more about the plans of the American company for the year 2017, visit after January 6 and the revelations of Steven Mollenkopf.
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